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US 6,633,005 B2Granted
Multilayer RF amplifier module
AssigneeMicro Mobio Corporation
InventorsIkuroh Ichitsubo, Guan-Wu Wang
Life of this patent
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Abstract
An RF amplifier module includes PC boards laminated atop a bottom conductor plate. The boards include an RF semi-conductor amplifier chip mounted in a well extending to the bottom plate disposed in electrical connection with the chip.
Claims28
A radio frequency amplifier module comprising:
- a plurality of printed circuit boards laminated atop a bottom electrical conductor plate, and including a radio frequency semiconductor amplifier chip mounted in a well extending through said boards in electrical connection therewith and electrically bonded directly atop said plate;
- said chip includes top terminals electrically joined to one of said boards, and a metalized base directly bonded atop said plate for providing an integral electrical ground for said chip;
- and
- said bottom plate is an electrical ground for said printed circuit boards electrically interconnecting said boards and said chip base.
1 more element
Dependencies are inferred from the claim text.