Tape carrier having high flexibility with high density wiring patterns

A tape carrier package comprising:

• a base film made of an insulating material;
• wiring patterns formed on said base film, each of said wiring patterns being adjacent to each other, each of said wiring patterns having a width, each of said adjacent wiring patterns being separated by a space therebetween, the width of each wiring pattern and the space therebetween forming a pitch;
• at least one semiconductor device each mounted on or in a device hole formed at said base film;
• and
• a bending area of said base film in which a plurality of holes are formed regularly, the width of each of said holes in the direction perpendicular to said wiring patterns being larger than the pitch of each wiring pattern plus the width of an adjacent wiring pattern in said bending area.

A method of manufacturing a tape carrier, said method comprising:

• preparing a base film made of an insulating material;
• forming a plurality of holes regularly in a bending area of said base film;
• and
• forming wiring patterns on a surface of said base film, each of said wiring patterns being adjacent to each other, each of said wiring patterns having a width, each of said adjacent wiring patterns being separated by a space therebetween, the width of each wiring pattern and the space therebetween forming a pitch;
• the width of each of said holes in the direction perpendicular to said wiring patterns being larger than the pitch of each wiring pattern plus the width of an adjacent wiring pattern in said bending area.