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US 6,632,881 B1Granted
Encapsulant of epoxy resin and liquid aromatic amine curing agent
AssigneeHitachi Chemical Company, Ltd.
InventorsSatoru Tsuchida, Masahiko Osaka, Masatsugu Ogata
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Abstract
An encapsulating epoxy resin composition comprising an epoxy resin which is liquid at normal temperature, a curing agent containing an aromatic amine which is liquid at normal temperature, an inorganic filler, and rubber particles; an encapsulant comprising this composition; and an electronic device having an encapsulating member comprising a cured product of this encapsulant.
Claims15
An encapsulant, comprising an epoxy resin composition which includes an epoxy resin which is liquid at normal temperature, a curing agent and an inorganic filler;
- said composition further comprising rubber particles;
- and
- said curing agent including a liquid aromatic amine which is liquid at normal temperature, said liquid aromatic amine being at least one selected from the group consisting of 3,3′-diethyl-4,4′-diaminodiphenylmethane and diethyltoluenediamine.
Dependencies are inferred from the claim text.