Method and apparatus for liquid-treating and drying a substrate
AssigneeInteruniversitair Microelekronica Centrum (IMEC VZW)
InventorsPaul Mertens, Marc Meuris
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AssigneeInteruniversitair Microelekronica Centrum (IMEC VZW)
InventorsPaul Mertens, Marc Meuris
Estimating the term…
The present invention is related to a method and apparatus for liquid treating and drying a substrate, such as a semiconductor wafer, the method comprising the step of immersing a substrate or a batch of substrates in a tank filled with a liquid, and removing the substrate(s) through an opening so that a flow of the liquid takes place through the opening during removal of the substrate. Simultaneously with the removal, a reduction of the surface tension of the liquid is caused to take place near the intersection line between the liquid and the substrate. For acquiring such a tensio-active effect, a uniform flow of a gas or vapor is used, or/and a local application of heat. The invention is equally related to an apparatus for performing the method of the invention.
A method for removing liquid from at least one flat surface of a substrate, said method comprising the steps of:
A method for removing liquid from at least one flat surface of a substrate, said method comprising the steps of:
A method for removing liquid from at least one surface of a substrate, said method comprising the steps of:
A method for removing liquid from at least one surface of a substrate, said method comprising the steps of:
A method for removing liquid from at least one surface of a substrate, said method comprising the steps of:
Dependencies are inferred from the claim text.