Three dimensional structure integrated circuit fabrication process
AssigneeElm Technology Corporation
InventorGlenn J. Leedy
Life of this patent
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Abstract
A Three-Dimensional Structure (3DS) Memory allows for physical separation of the memory circuits and the control logic circuit onto different layers such that each layer may be separately optimized. One control logic circuit suffices for several memory circuits, reducing cost. Fabrication of 3DS memory involves thinning of the memory circuit to less than 50 μm in thickness and bonding the circuit to a circuit stack while still in wafer substrate form. Fine-grain high density inter-layer vertical bus connections are used. The 3DS memory manufacturing method enables several performance and physical size efficiencies, and is implemented with established semiconductor processing techniques.
Claims35
A method of forming a stacked integrated circuit, comprising:
- forming an integrated circuit on a substrate;
- forming a substantially flexible substrate having integrated circuits, including thinning the flexible substrate before dicing the flexible substrate;
- and
- stacking together multiple substantially flexible substrates of integrated circuits on the substrate to form said stacked integrated circuit.
A method of forming a stacked integrated circuit structure, comprising:
- bonding together at least two integrated circuit wafers with a non-polymeric layer;
- following bonding, processing a surface of one of the integrated circuit wafers to thin said integrated circuit wafer.
A method of forming a stacked integrated circuit, comprising:
- forming an integrated circuit on a first substrate;
- forming at least one substantially flexible substrate having integrated circuits, including thinning the at least one flexible substrate before dicing the at least one flexible substrate;
- and
- stacking together the at least one substantially flexible substrate of integrated circuits on the first substrate to form said stacked integrated circuit.
Dependencies are inferred from the claim text.