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AssigneeSamsung Electronics Co., Ltd.
InventorsBok-moon Kang, Byung-se So, Jung-joon Lee
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A memory module and a method of packaging memory devices are provided. The method prepares semiconductor packages of the memory devices, each of which has external pins that include data pins and command signal pins, and mounts the packages on a printed circuit board, on which a first bus, a second bus, and a third bus are formed. The data pins of odd-numbered packages and even-numbered packages connect to the first bus and the second bus, respectively. The control signal pins connect to the third bus. Each package can optionally include dummy pins, where the dummy pins of the even-numbered packages and the odd-numbered packages respectively connect to the first and second buses so that each of the first, second and third buses connects to the same number of external pins. The pin assignment of the even-numbered packages can be different from the pin assignment of the odd-numbered packages to facilitate connections of the buses.
A method of packaging a plurality of memory devices comprising:
A method of packaging a plurality of memory devices comprising:
A memory module that includes a plurality of memory devices, comprising:
A memory module that includes a plurality of memory devices, comprising:
A method of packaging a plurality of memory devices, each of the memory devices having a plurality of external pins including data pins, command signal pins, and dummy pins;
A method of packaging a plurality of memory devices, each of the memory devices having a plurality of external pins including data pins, command signal pins, and dummy pins;
Dependencies are inferred from the claim text.