Particle material anisotropic conductive connection and anisotropic conductive connection material
AssigneeSony Chemicals Corp.
InventorsYukio Yamada, Toshiyuki Matsumoto
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Abstract
A particle material for anisotropic conductive connection, is comprised of a conductive particle and an insulating resin layer covering the surface thereof, wherein the insulating resin layer includes an insulating gelled resin with a gel proportion of at least 90%. The particle material can be manufactured by fixing an insulating gelled resin powder with a gel proportion of at least 90% to the surface of the conductive particle by a physical/mechanical method to form the insulating resin layer.
Claims9
A particle material for anisotropic conductive connection, comprising a conductive particle and an insulating resin layer covering the surface thereof, wherein the insulating resin layer comprises an insulating gelled resin with a gel proportion of at least 90%, wherein the conductive particle is not completely covered by the insulating resin layer, and wherein the insulating gelled resin has a softening point higher than the heating temperature during anisotropic conductive connection.
A method for manufacturing a particle material for anisotropic conductive connection, the particle material comprising a conductive particle and an insulating resin layer having a softening point higher than the heating temperature during anisotropic conductive connection covering the surface thereof, wherein the method comprises fixing an insulating gelled resin powder with a gel proportion of at least 90% to the surface of a conductive particle by a physical/mechanical method to form the insulating resin layer.
Dependencies are inferred from the claim text.