Low temperature bonding adhesive composition
AssigneeSumitomo Bakelite Co., Ltd.
InventorsJerrold C. Rosenfeld, Jerrine L. Neff
Life of this patent
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Abstract
An adhesive composition that bonds at low temperatures is disclosed. The composition is a solution in an organic solvent of a polyimide, an epoxy resin, and a cyanate. The polyimide can be a polyimidesiloxane, made from a dianhydride, an aromatic diamine that does not contain siloxane, and a siloxane diamine. The adhesive composition can be used to make a single layer tape, a coated tape, or a double-sided trilayer tape. The tape can bond an article, such as a chip, to a substrate, such as a circuit board.
Claims23
A composition comprising a solution in an organic solvent of
- (A) a polyimide;
- (B) an epoxy resin;
- and
- (C) a cyanate,
- wherein the polyimide is a polyimidesiloxane polymerized from a dianhydride, an aromatic diamine, that does not contain siloxane, and an aliphatic siloxane-containing diamine and wherein the polyimide, epoxy resin and the cyanate form an adhesive composition.
An adhesive composition comprising a solution of about 20 to about 50 wt % solids in an organic solvent of
- (A) a polyimidesiloxane made from
- (1) aromatic dianhydride;
- (2) diamine in an equivalent ratio to said aromatic dianhydride of about 1:2 to about 2:1, said diamine comprising
- (a) about 20 to about 99 wt %, based on total monomer, aromatic diamine that does not contain siloxane;
- and
- (b) about 1 to about 80 wt %, based on total monomer, aliphatic siloxane diamine having the general formula
- where R, is methyl, R2 is propyl, and m is 1 to 12;
- (B) about 20 to about 100 phr solid aromatic epoxy resin;
- and
- (C) about 2 to about 40 phr dicyanate selected from the group consisting of
- where p is 0 to 20.
An adhesive composition comprising a solution of about 30 to about 40 wt % solids in anisole of
- (A) a polyimidesiloxane made from
- (1) oxydiphthalic anhydride;
- (2) diamine in an equivalent ratio to said oxydiphthalic anhydride of about 1:2 to about 2:1, said diamine comprising
- (a) about 40 to about 80 wt % 1,3-bis(3-aminophenoxy)benzene;
- and
- (b) about 20 to about 60 wt % diamine having the general formula
- where R, is methyl, R2 is propyl, and m is 1 to 12;
- (B) about 30 to about 70 phr solid aromatic epoxy resin;
- and
- (C) about 10 to about 20 phr dicyanate selected from the group consisting of
An adhesive composition comprising a solution of about 20 to about 50 wt % solids in an organic solvent of
- (A) a polyimidesiloxane made from an aromatic dianhydride and a diamine;
- (B) about 20 to about 100 phr solid aromatic epoxy resin;
- and
- (C) about 2 to about 40 phr dicyanate.
An adhesive composition comprising a solution of about 30 to about 40 wt % solids in anisole including:
- (A) a polyimidesiloxane made from an aromatic dianhydride and a diamine;
- (B) about 30 to about 70 phr solid aromatic epoxy resin;
- and
- (C) about 10 to about 20 phr dicyanate.
Dependencies are inferred from the claim text.