Manufacture of prepregs and laminates with relatively low dielectric constant for printed circuit boards
AssigneePolyclad Laminates, Inc.
InventorDong Zhang
Life of this patent
Estimating the term…
Abstract
The present invention is directed to filled prepregs, laminates, printed circuit boards comprising a reinforcing material impregnated with a cured polymeric resin, the cured polymeric resin comprising multicellular polymeric microspheres as a filler. Pre-pregs, laminates and printed circuit boards prepared by this method have reduced dielectric constant as low as 3.0, depending upon the resin system of the matrix. In addition, such laminates and printed circuit boards have enhanced electrical, thermal and mechanical properties as well as improved machinability, low density and a uniform appearance.
Claims65
A filled prepreg composition comprising a reinforcing material impregnated with (i) a polymeric resin, and (ii) multicellular polymeric microspheres comprising at least two open or closed cavities as a filler.
A process for the preparation of a filled prepreg composition, the process comprising the following steps in the specified order:
- (i) impregnating a reinforcing material with a varnish, the varnish containing a solvent, multicellular polymeric microspheres composing at least two open or closed cavities as a filler, and a monomer or a polymeric resin which is partially cured, (ii) evaporating solvent from the impregnated reinforcing material, and (iii) optionally heating the impregnated material to cure the monomer or further cure the polymeric resin to form a pre-preg.
Dependencies are inferred from the claim text.