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US 6,632,375 B2Granted
Method for forming a concave micro-relief in a substrate and use of said method for producing optical components
AssigneeCommissariat a l'Energie Atomique
InventorsMarc Rabarot, Jean Marty
Life of this patent
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Abstract
Process for the formation of at least one concave relief (124, 145) in a substrate comprising forming at least one embossment of material subject to creep (100) on the substrate (120), —heating of the material subject to creep to a temperature sufficiently high to cause creep of the said material, and—etching of the substrate and the crept material to form relief in the substrate. According to the invention, the crept material is solidified in a state in which it has a concave relief.
Claims20
Process for forming at least a concave relief in a substrate comprising:
- forming at least one embossment on the substrate made of a material subject to creep, the embossment of the material subject to creep having a shape factor defined by a ratio of the average height h of the embossment to one of the dimensions of a contact area s between the embossment and the substrate,
- heating the material subject to creep to a sufficiently high temperature to cause the material to creep, and
- etching the substrate and the crept material to form a relief on the substrate,
- wherein at least one of the parameters selected among the shape factor and the heating temperature is adjusted to apply a concave relief to the embossment and the crept material is solidified in a state in which it has the concave relief.
1 more element
Dependencies are inferred from the claim text.