Conductive oxide coating process
OwnerRobert L. Goldberg, Michael Gullainventors
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Abstract
The invention is directed to a process for electroplating a non-conducting surface such as through-hole walls within a printed circuit board substrate. The process comprises formation of a conductive oxide coating over a substrate, preferably by immersion of said substrate in an aqueous oxidative desmear solution for a time sufficient to form a coating containing conductive dielectric oxidation residue and then, in the absence of a step of forming an additional conductive coating over the residue coating or removing the coating, electroplating metal onto said surface by immersion of the substrate having the coating in an electroplating solution.
Claims11
A process for electroplating a non-conducting substrate, said process comprising the steps of (1) forming a coating comprising manganese oxide over at least a portion of said substrate by immersing the non-conducting substrate in an aqueous permanganate desmear solution for a time sufficient to form said coating over at least
- portions of said substrate, (2) reducing said manganese oxide coating over said substrate to a metal, and (3) electroplating metal onto said coating by immersion of the substrate into an electroplating solution while passing a current from an electrode, through said solution to said substrate.
Dependencies are inferred from the claim text.