Distributed power supplies for microelectronic workpiece processing tools

An apparatus for processing microelectronic workpieces, comprising:

• a housing at least partially enclosing a process environment;
• a first processing chamber within the housing, the first processing chamber having at least one first electrically powered device;
• a second processing chamber within the housing, the second processing chamber having at least one second electrically powered device;
• a first power supply electrically coupled to the first processing chamber to provide electrical power to the at least one first electrically powered device, the first power supply having an input portion configured to receive electrical power and an output portion configured to transmit electrical power, the output portion being electrically decoupled from all other processing chambers of the housing;
• and
• a second power supply electrically coupled to the second processing chamber to provide electrical power to the at least one second electrically powered device, the second power supply having an input portion configured to receive electrical power and an output portion to transmit electrical power, the output portion of the second power supply being electrically decoupled from all other processing chambers of the housing.

An apparatus for processing microelectronic workpieces, comprising:

• a housing at least partially enclosing a process environment;
• a first processing chamber within the housing, the first processing chamber having at least one first electrically powered device;
• a second processing chamber within the housing, the second processing chamber having at least one second electrically powered device;
• a first power supply;
• a second power supply;
• a first electrical link coupled between the first power supply and the first processing chamber to transmit electrical power from the first power supply to the at least one first electrically powered device, the first electrical link having a first impedance;
• and
• a second electrical link coupled between the second power supply and the second processing chamber to transmit electrical power from the second power supply to the at least one second electrically powered device, the second electrical link having a second impedance at least approximately identical to the first impedance.

An apparatus for processing microelectronic workpieces, comprising:

• a housing at least partially enclosing a process environment;
• a first processing chamber within the housing, the first processing chamber having a first vessel configured to contain a processing liquid, a first anode disposed in the first vessel, and a first cathode configured to be electrically coupled to a microelectronic workpiece;
• a second processing chamber within the housing, the second processing chamber having a second vessel configured to contain a processing liquid, a second anode disposed in the second vessel, and a second cathode configured to be electrically coupled to a microelectronic workpiece;
• a first power supply electrically coupled to at least one of the first anode and the first cathode with a first electrical link having a first length;
• and
• a second power supply electrically coupled to at least one of the second anode and the second cathode with a second electrical link having a second length at least approximately identical to the first length.

An apparatus for processing a microelectronic substrate, comprising:

• a housing at least partially enclosing a process environment;
• a first electroplating chamber in the housing, the first electroplating chamber having a first processing vessel configured to contain a processing fluid, the first electroplating chamber further having at least one electrically operated valve positioned to control a flow of the processing fluid into and/or out of the first processing vessel, the first electroplating chamber still further having an anode disposed within the first processing vessel, and a cathode configured to be electrically coupled to a microelectronic workpiece;
• a first power supply having an input portion configured to receive electrical power and an output portion electrically coupled to the anode and the cathode;
• a second electroplating chamber in the housing, the second electroplating chamber having a second processing vessel configured to contain a processing fluid, the second electroplating chamber further having at least one electrically operated valve positioned to control a flow of the processing fluid into and/or out of the second processing vessel, the second electroplating chamber still further having an anode disposed within the second processing vessel, and a cathode configured to be electrically coupled to a microelectronic workpiece;
• and
• a second power supply having an input portion configured to receive electrical power and an output portion electrically coupled to the anode and the cathode, wherein the output portion of the second power supply is electrically isolated from the anode, the cathode and the at least one valve of the first electroplating chamber, and the output portion of the first power supply is electrically isolated from the anode, the cathode and the at least one valve of the second electroplating chamber.

An apparatus for processing microelectronic workpieces, comprising:

• a processing chamber having a vessel configured to hold a processing fluid;
• a first electrode disposed within the vessel;
• a second electrode positioned proximate to the vessel and configured to be removably electrically coupled to a microelectronic workpiece;
• and
• a power supply positioned proximate to the processing chamber and having an input portion configured to receive electrical power, the power supply further having an output portion electrically coupled to the first and second electrodes, the output portion being electrically decoupled from electrodes of any other processing chambers.

An apparatus for processing microelectronic workpieces, comprising:

• a processing chamber having a vessel configured to hold a processing fluid for electroplating a microelectronic workpiece;
• an anode disposed within the vessel;
• a support member configured to engage and support a microelectronic workpiece, the support member having a cathode configured to be removably electrically coupled to a microelectronic workpiece;
• an electrically powered fluid control valve in fluid communication with the vessel to control a flow of fluid into and/or out of the vessel;
• and
• a power supply positioned proximate to the processing chamber, the power supply having an input portion configured to receive electrical power and an output portion electrically coupled to at least one of the anode and the cathode, the output portion of the power supply being decoupled from anodes, cathodes and actuators of any other vessels for processing microelectronic workpieces.

An apparatus for processing microelectronic workpiece, comprising:

• housing means for at least partially enclosing a process environment;
• first processing means for processing a microelectronic workpiece, the first processing means being positioned within the housing means and having a first anode and a first cathode;
• second processing means for processing a microelectronic workpiece, the second processing means being positioned within the housing means and having a second anode and a second cathode;
• first electrical power means electrically coupled to the first processing means for providing electrical power to at least one of the first cathode and the first anode;
• and
• second electrical power means electrically coupled to the second processing means for providing electrical power to at least one of the second cathode and the second anode.

An apparatus for electrochemically processing a microelectronic workpiece comprising:

• a first electrochemical processing reactor including first and second electrodes disposed to electrochemically process a microelectronic workpiece at the first electrochemical processing reactor;
• a second electrochemical processing reactor including first and second electrodes disposed to electrochemically process a microelectronic workpiece at the second electrochemical processing reactor;
• a power supply having one or more power outputs to provide electrochemical processing power to the first and second electrode of the first electrochemical processing reactor and the first and second electrodes of the second electrochemical processing reactor;
• and
• a power distribution system connecting the one or more power outputs of the power supply to the electrodes of the first and second electrochemical processing reactors so that the characteristics of the electrochemical processing reactor is substantially the same as the characteristics of the electrochemical processing power reaching the first and second electrodes of the second electrochemical processing reactor.

An apparatus for electrochemical processing microelectronic workpieces comprising:

• a first electrochemical processing reactor including first and second electrodes disposed to electrochemically process a microelectronic workpiece at the first electrochemical processing reactor;
• a second electrochemical processing reactor including first and second electrodes disposed to electrochemically process a microelectronic workpiece at the second electrochemical processing reactor;
• and
• a power supply and distribution system providing electrochemical processing power to the electrodes of the first and second electrochemical processing reactors so that the characteristics of the electrochemical processing power reaching the first and second electrodes of the first electrochemical processing reactor is substantially the same as the characteristics of the electrochemical processing power reaching the first and second electrodes of the second electrochemical processing reactor.