Switched uniformity control

A component delivery mechanism for distributing a component inside a process chamber, the component being used to process a work piece within the process chamber, the component delivery mechanism, comprising:

• a component source for supplying the component;
• a spatial distribution switch having a single input for receiving the component from the component source, and at least a first output and a second output for discharging the component, the switch having at least a first condition, directing the component through the first output, and a second condition, directing the component through the second output;
• at least a first component output and a second component output, the first component output being coupled to the first output of the spatial distribution switch, and the second component output being coupled to the second output of the spatial distribution switch, the first component output being arranged for outputting the component into an inner region of the process chamber, the second component output being arranged for outputting the component into an outer region of the process chamber, the first region of the process chamber corresponding to a center portion of the work piece and the second region corresponding to an outer portion of the work piece;
• and
• a controller for controlling the spatial distribution switch, the controller being configured for directing the spatial distribution switch between at least the first and second conditions, the controller performing time multiplexing with the spatial distribution switch so as to effect the concentration of the component in the inner and outer regions of the process chamber.

A component delivery mechanism for distributing a component inside a process chamber, the component being used to process a work piece within the process chamber, the component delivery mechanism, comprising:

• a plurality of component outputs for outputting the component to a desired region of the process chamber, the plurality of component outputs including at least a first component output arranged to output the component to a first region of the process chamber and a second component output arranged to output the component to a second region of the process chamber, the first region of the process chamber corresponding to a center portion of the work piece and the second region corresponding to an outer portion of the work piece;
• and
• a spatial distribution switch being arranged for directing the component to the plurality of component outputs, the spatial distribution switch utilizing time modulation to direct the component to the first component output at a first time, and to direct the component to the second component output at a second time,
• wherein the component that is outputted into the process chamber via the component outputs and spatial distribution switch is part of a process recipe that is configured to ignite and sustain a plasma inside the process chamber.

A component delivery mechanism for distributing a plasma forming component inside a process chamber, the plasma forming component being used to process a work piece within the process chamber, the component delivery mechanism, comprising:

• a spatial distribution switch for controlling the distribution of the plasma forming component into the process chamber so as to ignite and sustain a plasma inside the process chamber, the spatial distribution switch having an inlet for receiving the component from a component source configured for supplying the component, and at least two distinct outlets for separately delivering the component to at least two spatially distinct component outputs configured for outputting the component directly into the process chamber, the spatial distribution switch including a first outlet for delivering the component to a first component output configured for outputting the component directly into an inner region of the process chamber and a second outlet for delivering the component to a second component output configured for outputting the component directly into an outer region of the process chamber, the spatial distribution switch being configured to selectively distribute the received component between the first and second outlets via time multiplexing so as to effect the concentration of the component in the inner and outer region of the process chamber.

A plasma reactor for processing a semiconductor substrate, comprising:

• a process chamber in which a plasma is ignited and sustained for processing the semiconductor substrate, the process chamber including an inner process zone and an outer process zone, the inner process zone being positioned over an inner region of the semiconductor substrate, the outer process zone being positioned over an outer region of the semiconductor substrate;
• a gas injection mechanism configured to distribute gaseous source materials into the process chamber, the gas injection mechanism comprising a single gas supply, a gas injection port and a gas distribution switch, the single gas supply being configured to deliver the gaseous source materials to the gas injection port, the gas injection port being configured to release the gaseous source materials into the process chamber, the gas injection port being divided into a plurality of individual and spatially distinct ports including at least an inner port arranged to release the gaseous source materials into the inner process zone of the process chamber and an outer port arranged to release the gaseous source materials into the outer process zone of the process chamber, the inner and outer ports being coupled to the single gas supply through the gas distribution switch, the gas distribution switch being configured to direct the gaseous source material supplied by the single gas supply to the inner or outer port, wherein the gaseous source materials are introduced into the process chamber through at least one of the ports in order to create the plasma inside the process chamber.