US 6,632,314 B1 · Method of making a lamination and surface planarization for multilayer thin film interconnect

Abstract

A method of making a surface planarization is provided using a separate pre-cut or precured film laminated onto a metallized surface to form planarized dielectric coating. The method comprises the steps of: (a) providing a thin film interconnect module with a polyimide adhesive laminated with a pre-cut or pre-cured polyimide lamination film on the top of the polyimide adhesive, the polyimide lamination film being covered with a glass plate; (b) applying pressure and heat in a synchronized format to ensure a uniform curing and gap filling in the thin film module metal for the adhesive layer; and (c) releasing the glass plate to expose a smooth lamination film surface.

Claims11

Dependent claims

A method for forming a planarized surface on a multilayer thin film interconnect structure comprising the steps of:

providing an interconnect structure having at least one layer of metal wiring and at least one layer of polyimide dielectric;
placing a pre-cured polyimide film directly on the at least one layer of metal wiring, without use of an adhesive, wherein the polyimide film is formed on a glass cover plate and cured prior to placing the polyimide film on the interconnect structure;
laminating the glass cover plate, polyimide film, and interconnect structure, thereby forming the planarized surface;
and
removing the glass cover plate from the laminated polyimide film and interconnect structure.

2 more elements

Dependencies are inferred from the claim text.

Method of making a lamination and surface planarization for multilayer thin film interconnect

Life of this patent

Method of making a lamination and surface planarization for multilayer thin film interconnect

Life of this patent

Abstract

Claims11