Substrate cleaning method and substrate cleaning apparatus
AssigneeKabushiki Kaisha Toshiba
InventorsKenji Masui, Akio Kosaka, Hidehiro Watanabe
Life of this patent
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Abstract
A to-be-cleaned substrate is cleaned by use of an acid liquid agent in a cleaning cup, the remaining acid liquid agent is washed out by use of pure water, then an alkaline liquid agent is emitted to the surface of the to-be-cleaned substrate in the same cleaning cup to remove the acid liquid agent remaining on the to-be-cleaned substrate. A neutralization reaction between the acid and alkali is caused by emitting the alkaline liquid agent to the surface of the to-be-cleaned substrate so as to efficiently remove the acid liquid agent remaining on the surface of the to-be-cleaned substrate.
Claims14
A substrate cleaning method comprising:
- cleaning a to-be-cleaned substrate disposed in a cleaning cup by use of an acid liquid agent;
- cleaning the substrate use of a first alkaline liquid agent in the cleaning cup to neutralize residue of the acid liquid agent after the step of cleaning by use of the acid liquid agent;
- emitting one of a second alkaline liquid agent and hot pure water at 60° C. to 80° C. onto a surface of the to-be-cleaned substrate after the cleaning by the first alkaline liquid agent;
- rotating the to-be-cleaned substrate at a first speed between 100 rpm and 200 rpm to drive out the one of the second alkaline agent and the hot pure water emitted on the to-be-cleaned substrate to an edge thereof;
- and
- rotating the to-be-cleaned substrate at a second speed of at least 700 rpm to spin off the one of the second alkaline gent and the hot pure water driven out to the edge of the to-be-cleaned substrate.
A substrate cleaning method comprising:
- oxidizing impurities on a surface of a to-be-cleaned substrate held in a cleaning cup by use of a oxidizing agent;
- cleaning the to-be-cleaned substrate as held in the cleaning cup by use of a reducing agent to remove the oxidized impurities after the oxidizing step;
- emitting one of an alkaline liquid agent and hot pure water at 60° C. to 80° C. onto a surface of the to-be-cleaned substrate after the cleaning by the reducing agent;
- rotating the to-be-cleaned substrate at a first speed between 100 rpm and 200 rpm to drive out the one of the alkaline agent and the hot pure water emitted on the to-be-cleaned substrate to an edge thereof;
- and
- rotating the to-be-cleaned substrate at a second speed of at least 700 rpm to spin off the one of the alkaline agent anti the hot pure water driven out to the edge of the to-be-cleaned substrate.
A substrate cleaning method comprising:
- cleaning a to-be-cleaned substrate disposed in a cleaning cup by use of an acid liquid agent;
- cleaning the cleaning cup by use of one of pure water and a first alkaline liquid agent after the cleaning by use of the acid liquid agent;
- and
- cleaning the substrate by use of a second alkaline liquid agent in the cleaning cup to neutralize residue of the acid liquid agent after the cleaning of the cup.
Dependencies are inferred from the claim text.