Optimized silicon wafer gettering for advanced semiconductor devices

A method of manufacturing a silicon wafer with gettering characteristics, comprising:

• adding polycrystalline silicon to a crucible;
• adding a nitrogen-containing dopant to the crucible;
• heating the crucible to form a nitrogen-doped silicon melt;
• pulling a silicon crystal from the melt according to the Czochralski technique;
• forming a silicon wafer from the silicon crystal, wherein the silicon wafer includes a frontside and a backside;
• polishing the frontside of the silicon wafer such that the frontside of the wafer has less damage than the backside of the wafer;
• placing the silicon wafer into a deposition chamber;
• heating the wafer;
• and
• simultaneously depositing an epitaxial first film of a predefined compound onto the frontside of the wafer and polycrystalline film of the predefined compound onto the backside of the wafer, wherein the simultaneous deposition comprises providing a common flow of gas to both the frontside and the backside of the silicon wafer, and wherein providing the common flow of gas comprises introducing the common flow of gas to both the frontside and the backside of the wafer through a common inlet into the deposition chamber.