Method & apparatus for packaging high frequency components

A method for fabricating a package for retaining an electrical component with a plurality of connection points, and the method for fabricating comprises the acts of:

• providing a dielectric substrate with a top surface and a bottom surface;
• forming a conductive ground plane, pad, and differential pad portions on the top surface and the bottom surface of the dielectric substrate;
• electrically coupling corresponding ones of the ground plane, pad, and differential pad portions on the top surface and the bottom surface of the dielectric substrate to provide controlled impedance external differential connections to the electrical component within the package;
• bonding an electrically conductive cover to form an electrically shielded cavity around the electrical component.

A package comprising:

• an electrically conductive cover;
• a base coupled to the electrically conductive cover, wherein the base includes an electrically insulating layer coupled between two electrically conductive patterned layers, wherein a first one of the two electrically conductive patterned layers includes one or more pairs of differential pads, wherein each pair of differential pads is configured to convey a pair of differential signals, wherein a second one of the two layers includes a plurality of electrical contacts, wherein a first portion of the electrical contacts are each connected to a respective one of the differential pads by a via extending through the electrically insulating layer;
• and
• an electrical component electrically coupled to a first pair of differential pads;
• wherein the base and the electrically conductive cover form an enclosure around the electrical component.