Mixing apparatus

#This invention relates to an electroplating apparatus and, in particular, such an electroplating apparatus which comprises means for facilitating mixing and dissolution of a solute in a solvent, and minimising the amount of undissolved solutes to be carried away from a mixing chamber, e.g. into a chamber of the apparatus where electroplating takes place.

#Prior electroplating apparatus is known. An example of prior electroplating apparatus consists of two housings wherein a respective chamber is located therein. A first chamber is for dissolving solutes in a solvent to form an electrolyte solution. The solution is then delivered to a second chamber in which electroplating occurs.

#One problem associated with this conventional type of apparatus is that undissolved solute in the first chamber may be delivered, together with the electrolyte solution, to the second chamber. This not only contaminates the second chamber with undissolved solute, which will affect the electroplating process, it is also uneconomical as additional solute is needed to compensate the undissolved solute which is unused for the intended purpose in the second chamber.

#An embodiment of the present invention is now described, by way of example only, with reference to the following drawings in which:

#FIG. 1 is a schematic diagram showing a cross section of an electroplating apparatus according to the present invention;

#FIG. 2 is a perspective view of a mixing chamber of the electroplating apparatus shown in FIG. 1;

#An embodiment of an electroplating apparatus 1 according to the present invention is shown in FIG. 1. The electroplating apparatus 1 can generally be divided into two zones, namely a high concentration zone 44 in which a mixing chamber 12 is located, and a low concentration zone 42 in which a plating sump 26 and a plating cell 28 are located. Above the mixing chamber 12 is provided a feeder 2 driven by a DC motor 6 which is in turn powered by a power supply 8. The feeder 2 is generally in the form of a chamber with a narrower lower portion within which a further filter 4 (not shown) is comprised. Solute (e.g. solid CuO powder) contained in the housing of the feeder 2 is filtered through the filter 4 before being transported to an outlet 46 of the feeder 2 via a screw feeder 10.

#The mixing chamber 12 is generally rectangular, as shown in FIGS. 1 and 2. While the mixing chamber 12 as shown is generally in the shape of a rectangular tank, a different configuration of the mixing chamber 12 may be used. An elongate tube 16 with an inlet 15 having an enlarged opening is arranged on one side of the mixing chamber 12. The mixing chamber 12 further comprises a separator 22 and a vortex destroyer 48. The elongate tube 16 is substantially parallel to the vertical axis of the mixing chamber 12 while the separator 22 and the vortex destroyer 48 are arranged horizontally across the mixing chamber 12. As can be seen, the mixing chamber 12 generally comprises the separator 22 located in an upper portion, the vortex destroyer 48 in a middle portion and a mixing mechanism 20 in a lower portion thereof. The mixing mechanism 20 of the mixing chamber 12 will be described in more detail.

#Still referring to FIG. 1, the plating sump 26 is generally in the form of a tank defining a cavity therein. The plating sump 26 is of a relatively large size as compared to the mixing chamber 12. The actual capacities of the mixing chamber 22 and the plating sump 26 are approximately 200 l and 1200 l respectively, although different sizes may also be used. A channel member or pipe 24 leading from an outlet 52 attached to the upper portion of the mixing chamber 12 is connected to the plating sump 26. A further channel member or pipe 25 leading from an outlet 53 of the plating sump 26 is connected to the mixing chamber 12.