Method for fabricating printed circuit board
AssigneeLG Electronics Inc.
InventorsNam-Jin Kim, Young-Cheol Ahn, Won-Jae Kim
Life of this patent
Estimating the term…
Abstract
A method for fabricating a printed circuit board includes the steps of: fabricating a printed circuit board having at least one collapsed portion; depositing a first solder resist in the collapsed portion; exposing the first solder resist-coated printed circuit board at a pressure lower than atmospheric pressure for a predetermined time; coating a second solder resist on the entire surface of the printed circuit board; and drying and hardening the first and the second solder resists. With this method, when a solder resist is coated, since an air space does not remain in a blind via hole, the reliability of the attachment between a printed circuit board and the solder resist layer is increased.
Claims9
A method for fabricating a printed circuit board comprising the steps of:
- fabricating a printed circuit board having at least one collapsed portion;
- depositing a first solder resist in the collapsed portion;
- exposing the first solder resist-coated printed circuit board at a pressure lower than atmospheric pressure for a predetermined time and removing air from the collapsed portion;
- coating a second solder resist on the entire surface of the printed circuit board and filling the collapsed portion with the second solder resist;
- and
- drying and hardening the first and second solder resists.
A method for fabricating a printed circuit board having a plurality of circuit pattern layers, an insulating layer for insulating the circuit pattern layers and a plated layer for connecting the circuit pattern layers insulated by the insulating layer, comprising the steps of:
- providing a window screen having a plurality of windows on the printed circuit board;
- forming the plated layer at a collapsed portion which is formed as a via hole, and coating a solder resist only at the outer periphery of the collapsed portion through the windows;
- exposing the printed circuit board coated with the solder resist at a pressure lower than atmospheric pressure in a vacuum chamber and removing air from the collapsed portion;
- coating an additional solder resist at the collapsed portion so as to fill the collapsed portion with the additional solder resist;
- and
- drying and hardening the solder resists.
Dependencies are inferred from the claim text.