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US 6,631,807 B2Granted
Chip tray
AssigneeOki Electric Industry Co., Ltd.
InventorsMasahisa Nemoto, Toshihiko Ichioka
Life of this patent
Estimating the term…
Abstract
A chip tray includes a first member (11) having an adhesive (13) on an upper face thereof and a second member (12) having upper and lower faces and at least one chip carrying section (14) having a through hole (15) extending downwardly from a bottom of the chip carrying section to the lower face of the second member. The second member is placed upon the first member such that the upper face of the first member is opposed to the lower face of the second member.
Claims8
A semiconductor chip tray comprising:
- a plate member having front and rear surfaces;
- a semiconductor chip containing portion formed in the front surface of the plate member and having a bottom face;
- a through hole formed in the plate member and extending from the bottom face of the semiconductor chip containing portion to the rear surface of the plate member, wherein the through hole has an area smaller than the bottom face of the semiconductor chip containing portion;
- and
- an adhesive layer disposed on the rear surface of the plate member so that the adhesive layer covers the through hole.
2 more elements
Dependencies are inferred from the claim text.