Apparatus for sawing wafers employing multiple indexing techniques for multiple die dimensions
AssigneeMicron Technology, Inc.
InventorsSalman Akram, Derek J. Gochnour, Michael E. Hess, David R. Hembree
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Abstract
A semiconductor wafer saw and method of using the same for dicing semiconductor wafers are disclosed comprising a wafer saw including variable lateral indexing capabilities and multiple blades. The wafer saw, because of its variable indexing capabilities, can dice wafers having a plurality of differently sized semiconductor devices thereon into their respective discrete components. In addition, the wafer saw with its multiple blades, some of which may be independently laterally or vertically movable relative to other blades, can more efficiently dice silicon wafers into individual semiconductor devices.
Claims20
A semiconductor substrate singulation saw, comprising:
- a substrate support, said substrate support including a substantially planar surface;
- and
- at least two substantially parallel saw blades having respective centers of rotation along a substantially common axis when in a cutting position and supported above said substrate support so as to cut into a semiconductor substrate positioned thereon without intersecting a plane defined by said substantially planar surface, at least one blade of said at least two substantially parallel saw blades being laterally translatable relative to at least one other of said at least two substantially parallel saw blades.
An apparatus for singulating a semiconductor substrate, comprising:
- a substrate support;
- and
- at least two substantially parallel saw blades positioned above said substrate support, at least one of said substrate support and said at least two substantially parallel saw blades being laterally translatable relative to the other, at least one of said at least two substantially parallel saw blades being laterally translatable relative to another of said at least two substantially parallel saw blades, said at least two substantially parallel saw blades having respective centers of rotation along a substantially common axis when in a cutting position.
An apparatus for singulating a semiconductor substrate, comprising:
- a substrate support;
- and
- at least two substantially parallel saw blades positioned above said substrate support, at least one of said substrate support and said at least two substantially parallel saw blades being laterally translatable relative to the other, at least one of said at least two substantially parallel saw blades being independently raisable with respect to another of said at least two substantially parallel saw blades, said at least two substantially parallel saw blades having respective centers of rotation along a substantially common axis when in a cutting position.
Dependencies are inferred from the claim text.