Method of forming integral passive electrical components on organic circuit board substrates

Abstract

A process for forming stable integrated resistors (14) and capacitors (28) on organic substrates (12). The resistors (14) and capacitors (28) are capable of a wide range of resistance and capacitance values, yet can be processed in a manner that does not detrimentally effect the organic substrate (12) or entail complicated processing. The method generally entails the use of thick-film materials usually of the types used to form resistors and capacitors on ceramic substrates. The thick-film materials are applied to an electrically-conductive foil (20) and then heated to bond the thick-film material to the foil (20) and form a solid resistive or capacitive mass (16/30). The foil (20) is then laminated to an organic substrate (12), such that the resistive/capacitive mass (16/30) is attached to and preferably embedded in the organic substrate (12). Finally, the foil (20) is etched to form at least one of two terminals that contact the resistive/capacitive mass (16/30) and thereby complete the passive electrical component (14/28). Resistors (14) can also be formed of polymer thick-film (PTF) inks, in which case the PTF ink is cured on the foil (20) for an extended period at a temperature sufficient to completely cure the ink prior to laminating the foil (20) to the organic substrate (12).

Dependencies are inferred from the claim text.