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US 6,631,077 B2Granted
Heat spreader with oscillating flow
AssigneeThermal Corp.
InventorJon Zuo
Life of this patent
Estimating the term…
Abstract
A heat spreader includes a plate having a first and second ends and a plurality of channels between the ends. A reservoir is located at the first end. A fluid oscillator oscillates a fluid between the first and second ends with a reciprocating flow. The oscillator is integrally contained within the plate.
Claims21
A heat spreader positioned within a housing containing an integrated circuit comprising:
- a plate having a first and second ends and a plurality of channels therebetween, said plate being coupled to a top surface of said integrated circuit and;
- a reservoir at the first end;
- and
- a piezoelectric oscillator for oscillating a fluid between the first and second ends with a reciprocating flow, the oscillator being integrally contained within the plate.
1 more element
A heat spreader hermetically sealed within a housing containing an integrated circuit, said heat spreader comprising:
- a plate having a first and second ends and a plurality of channels therebetween, said plate being coupled to a too surface of said integrated circuit within said an integrated circuit housing;
- a reservoir at the first end;
- and
- means for oscillating a fluid between the first and second ends with a reciprocating flow, the oscillating means being integrally contained within the plate.
1 more element
Apparatus comprising:
- a circuit board;
- an integrated circuit hermetically sealed within a housing and connected to the circuit board;
- and
- a heat spreader thermally coupled to the integrated circuit within said housing, comprising:
- a plate having a first and second ends and a plurality of channels therebetween;
- a reservoir at the first end;
- and
- a piezoelectric oscillator for oscillating a fluid between the first and second ends with a reciprocating flow, the oscillator being integrally contained within the plate.
5 more elements
A thermally efficient semiconductor packaging structure comprising:
- a hermetically sealed housing;
- an integrated circuit located within said housing, said integrated circuit having a top surface;
- and
- a heat spreader positioned within said housing and thermally and mechanically coupled to said top surface of said integrated circuit, said heat spreader comprising;
- a plate having a first and second ends and a plurality of channels therebetween and;
- a reservoir at the first end;
- and
- a piezoelectric oscillator for oscillating a fluid between the first and second ends with a reciprocating flow, the oscillator being integrally contained within the plate.
5 more elements
Dependencies are inferred from the claim text.