Method for forming thick film pattern and photosensitive paste used therefor

Abstract

A method for forming a thick film pattern is provided which can easily perform pattern formation even when a photosensitive paste containing a powdered conductor at a high content and having a low optical transmittance is used and which can form a thick film pattern having a rectangular cross-section and superior high-frequency transmission characteristics. In addition, a photosensitive paste used therefor is also provided. The thick film pattern having a predetermined shape can be formed by the steps of determining the photocurable depth d of a photosensitive paste; coating with the photosensitive paste in consideration of the photocurable depth d so as to form a photosensitive paste film having a predetermined thickness t; exposing the photosensitive paste film; and developing the exposed photosensitive paste film. Preferably, the coating with the photosensitive paste is performed so that the relationship between the photocurable depth d of the photosensitive paste and the thickness t of the photosensitive paste film satisfies the equation t≦d.

Dependencies are inferred from the claim text.