Apparatus for grinding wafers using a grind chuck having a high elastic modulus
AssigneeSamsung Electronics Co., Ltd.
InventorsBae-seung Park, Jin-heung Kim, Do-yun Hwang
Life of this patent
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Abstract
An apparatus for grinding wafers includes a grind chuck, formed of a soft material having a high elastic modulus, formed on a grind table. A grind unit grinds the wafer held by the grind chuck. Deionized water is supplied onto the wafer by a supply duct. A dam is formed on the grind table to surround the grind chuck, so that the wafer and the grind unit are submerged during grinding of the wafer. Also, an exhaust hole is formed through the grind table within an area surrounded by the dam, to exhaust the deionized water from the area surrounded by the dam.
Claims9
An apparatus for grinding wafers comprising:
- a process chamber for providing a space for performing a wafer grinding process;
- a grind table installed partially inside and partially outside of said process chamber;
- a plurality of grind chucks mounted on said grind table for holding wafers by a vacuum suction force, wherein each grind chuck comprises a body having a predetermined thickness and a shape corresponding to the wafers, and a ring-shaped porous portion formed in a central region of the body and having a plurality of pores;
- a deionized water supply duct for spraying deionized water onto the wafers;
- a first grind unit for grinding the wafers to a first thickness;
- a second grind unit for grinding the wafers to a second thickness;
- a plurality of dams formed on said grind table, each dam surrounding one of said grind chucks and forming a space in which one of said first and second grind units operates;
- deionized water exhaust holes formed through said grind table in the spaces surrounded by said dams;
- grind chuck accommodating grooves formed in said grind table in the spaces surrounded by said dams, for accommodating said grind chucks;
- intake and exhaust grooves formed in said grind chuck accommodating grooves corresponding to the porous portions of the grind chuck bodies;
- and
- a vacuum pump and a blower connected to said intake and exhaust grooves through intake and exhaust holes formed through said grind table.
An apparatus for grinding wafers comprising:
- a grind table;
- a grind chuck, mounted on said grind table, that holds a wafer by vacuum force;
- a grind unit that grinds the held wafer;
- a supply duct that supplies deionized water;
- a dam formed on said grind table to surround said grind chuck, so that the held wafer and said grind unit are submerged during grinding of the held wafer;
- a grind chuck accommodating groove formed in said grind table in an area surrounded by said dam, for accommodating said grind chuck;
- and
- an exhaust hole, formed through said grind table within the area surrounded by said dam, that exhausts the deionized water from the area surrounded by said dam.
Dependencies are inferred from the claim text.