Back to results
US 6,629,848 B2Granted
Method for providing uniform pressure
AssigneeSilitek Corporation
InventorWen Kuan Lin
Life of this patent
Estimating the term…
Abstract
A method provides uniform pressure to contacts electrically jointing a first circuit board (a flexible circuit board) and a second circuit board (a flexible circuit board or a rigid circuit board), wherein the first circuit board is lapped on the second circuit board and an elastomer is provided and exerts pressure on the contacts. At least one fixing point is provided atop the transverse of the elastomer to uniformly distribute a pressing force of the elastomer on the contacts. Therefore, the elastomer is not deformed by high temperature process.
Claims7
A method for providing uniform pressure to contacts comprising the steps of:
- electrically jointing a first circuit board and a second circuit board, the first circuit board being lapped on the second circuit board and an elongate elastomer being provided to extend longitudinally along and exert pressure on the contacts, the elastomer having longitudinally opposed ends and a pair of opposed side edges extending intermediately therebetween;
- capturing the contacts and elastomer between first and second outer casing members each defining a planar inner surface projecting transversely beyond both opposed side edges of the elastomer;
- and,
- forming at least a pair of fixing points positioned respectively on opposed lateral sides of the elastomer, each transversely offset from an intermediate portion of one side edge of the elastomer to uniformly distribute a pressing force of the elastomer on the contacts.
1 more element
Dependencies are inferred from the claim text.