Method of and apparatus for making heat-sensitive stencil and heat-sensitive stencil material
AssigneeRiso Kagaku Corporation
InventorsJun Nakamura, Kenji Ohshima
Life of this patent
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Abstract
When thermally perforating a thermoplastic resin film of heat-sensitive stencil material by the use of a thermal head, supply of energy to the thermal head is cut at a time the diameter of the perforations becomes not smaller than 65% and not larger than 95% of a target diameter of the perforations.
Claims6
A method of making a stencil by thermally forming perforations arranged in both a main scanning direction and a sub-scanning direction in a thermoplastic resin film of heat-sensitive stencil material by the use of a heat source which is heated through a supply of energy, the heat source having a scanning pitch in each of the scanning directions, the method comprising the steps of:
- cutting the supply of energy to the heat source at a time when a diameter of the perforations becomes not smaller than 65% and not larger than 95% of a target diameter of the perforations.
A method of making a stencil by thermally forming perforations arranged in both a main scanning direction and a sub-scanning direction in a thermoplastic resin film of heat-sensitive stencil material by the use of a heat source which is heated through a supply of energy, the heat source having a scanning pitch in each of the scanning directions, the method comprising the steps of:
- cutting the supply of energy to the heat source at a time when an area of the perforations becomes not smaller than 42% and not larger than 90% of a target area of the perforations.
Dependencies are inferred from the claim text.