Processor and temperature control method therefor
AssigneeTokyo Electron Limited
InventorsTakaaki Hirooka, Masao Furuya
Life of this patent
Estimating the term…
Loading patent…
AssigneeTokyo Electron Limited
InventorsTakaaki Hirooka, Masao Furuya
Estimating the term…
A refrigerant circulating passage is provided in a bottom electrode in a processing chamber of an etching system. A refrigerant CW1 is fed from a refrigerant tank to the passage via a refrigerant supply pipe. The refrigerant is cooled in a cooler via a refrigerant pipe and is returned to the refrigerant tank. Temperature sensors provided in the refrigerant supply pipe and refrigerant discharge pipe, detect a feed temperature, an inlet temperature, an outlet temperature and a return temperature, respectively. A target differential value is derived from the heat quantity of a wafer. During processing, the temperature of the refrigerant CW1 is controlled, permitting an actual differential value between the inlet and outlet temperatures follow the target differential value which in turn permits the return temperature to follow a target return temperature which is obtained by subtracting the target differential value from a set temperature of the wafer W.
A method for controlling the temperature of an object to be processed, on a supporting table in a processing system, said system comprising a processing vessel including said supporting table having therein a refrigerant circulating passage, and a temperature control circuit for controlling a heat quantity and/or a flow rate of a refrigerant circulating in said refrigerant circulating passage,
A method for controlling the temperature of an object to be processed, on a supporting table in a processing system, said system comprising a processing vessel including said supporting table having therein a refrigerant circulating passage, and a temperature control circuit for controlling a heat quantity and/or a flow rate of a refrigerant circulating in said refrigerant circulating passage,
A method for controlling the temperature of an object to be processed, on a supporting table in a processing system, said system comprising a processing vessel including said supporting table having therein a refrigerant circulating passage, and a temperature control circuit for controlling a heat quantity and/or a flow rate of a refrigerant circulating in said refrigerant circulating passage,
A method for controlling the temperature of an object to be processed, on a supporting table in a processing system, said system comprising a processing vessel including said supporting table having therein a refrigerant circulating passage, an electrode through which a high frequency power is applied into said processing vessel, and a temperature control circuit for controlling a heat quantity and/or a flow rate of a refrigerant circulating in said refrigerant circulating passage,
A processing system comprising:
A processing system comprising:
Dependencies are inferred from the claim text.