Process for mechanically attaching a temporary lid to a microelectronic package

Abstract

A process for picking up and moving a microelectronic package during card assembly operations. A clipping lid having a top surface and at least two sides attaches to a substrate via friction where the sides act as leaf springs gripping the substrate. The top surface of the lid provides a clean, smooth, flat surface to which a vacuum probe may be attached. In the preferred embodiment, the lid and sides are formed from an integral piece of stainless steel. Also provided are flares at the bottom of each side to aid in guiding the lid onto the substrate. Protrusions are provided in the sides to prevent the lid from slipping too far onto the substrate and contacting the components mounted to the substrate. Also provided is at least one hole in the top surface to allow the lid to be pried free from the substrate after completion of the steps where vacuum probe movement is required.

Dependencies are inferred from the claim text.