Method of manufacturing a circuit print board
AssigneeMitsubishi Denki Kabushiki Kaisha
InventorsTakashi Kobayashi, Seiji Oka, Kazuo Funahashi, Hideki Tsuruse
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AssigneeMitsubishi Denki Kabushiki Kaisha
InventorsTakashi Kobayashi, Seiji Oka, Kazuo Funahashi, Hideki Tsuruse
Estimating the term…
The present invention is provided to prevent a rise of temperature of a heating element and temperature of a board by inserting a graphite sheet 1 having high thermal conductivity to a circuit print board without electrically connecting with a conductive hole 6. In order to accomplish the above object, a manufacturing method of a circuit print board according the present invention has a thermal diffusive sheet forming step for forming the thermal diffusive sheet 7 by bonding resin 2 to a graphite sheet 1. Next, the method has a through hole making step for making the through hole on the thermal diffusive sheet and an insulator bonding step for forming a core 10 by thermally pressing the insulator to the thermal diffusive sheet having the through hole 3. Through these steps, the graphite sheet 1 can be inserted into the circuit print board without electrically connecting with the conductive hole 6.
A method for manufacturing a circuit print board comprising:
Dependencies are inferred from the claim text.