System and method to reduce bond program errors of integrated circuit bonders

A computerized system for reducing bond program errors in a slave bonder prepared to attach connecting bonds onto bond pads of a slave integrated circuit, comprising:

• a first input data generator, associated with a master bonder, operable to collect data from a master integrated circuit which is related in geometry to said slave integrated circuit, comprising geometrical information of bond pads and images of alignment references;
• an analysis generator, associated with said master bonder and coupled to said first input data generator, operable to construct a network of relationships for said master bonder between said images of said alignment references and said geometrical information of said bond pads;
• a master file, coupled to said analysis generator, operable to store said network of relationships, said geometrical information and said images as a master bond program;
• a retriever, associated with said slave bonder and coupled to said master file, operable to retrieve said master bond program;
• a second input data generator associated with said slave bonder, operable to generate images as input information from alignment references on said slave integrated circuit;
• and
• a comparative corrector associated with said slave bonder, coupled to said retriever and said second data generator, operable to compare said master bond program with said slave circuit alignment references, and to correct any deviation found between said references and said program, whereby said bond program of said slave bonder is recomputed for bonding on said bond pads of said slave circuit.

A computer-implemented method for reducing operational program errors in a slave machine prepared to work on action sites of slave objects, comprising the steps of:

• generating input data, associated with a master machine, said data collected from a master object, related in geometry or history to said slave object, and comprising geometrical information of action sites and images of reference sites;
• generating an analysis for constructing a network of relationships between said images of reference sites and said geometrical information of action sites on said master object;
• storing said network of relationships, said geometrical information and said images in a master file as an operational master program;
• retrieving said master program for said slave machine;
• generating input information, associated with said slave machine, said information collected from said slave object and comprising images of reference sites;
• comparing said reference sites within said master program with said slave object reference sites;
• and
• correcting any deviation found between said sites and said x-y locations in said program, thereby re-computing said x-y locations in said operational program of said slave machine for working on said action sites of said slave object.

A computer-implemented method for reducing bond program errors in a slave bonder prepared to attach connecting bonds onto bond pads of a slave integrated circuit, comprising the steps of:

• generating input data associated with a master bonder, said data collected from a master integrated circuit, related in geometry to said slave integrated circuit, and comprising geometrical information of bond pads and images of alignment references;
• generating an analysis for constructing a network of relationships between said images of said alignment references and said geometrical information of said bond pads on said master circuit;
• storing said network of relationships, said geometrical information and said images in a master file as a master bond program;
• retrieving said master bond program for said slave bonder;
• generating input information, associated with said slave bonder, said information collected from said slave circuit and comprising images of alignment references;
• comparing said alignment reference images within said master bond program with said slave circuit alignment reference images;
• and
• correcting any deviation found between said reference images and said program, thereby re-computing said x-y locations in said bond program of said slave bonder for bonding on said bond pads of said slave circuit.