Cleaning compositions
AssigneeESC, Inc.
InventorsShahriar Naghshineh, Yassaman Hashemi
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Abstract
An aqueous cleaning composition comprising an alkanolamine, a tetraalkylammonium hydroxide, nonmetallic fluoride salt, a corrosion inhibitor, e.g. ascorbic acid or its derivatives alone or in combination, balance water. Such cleaning compositions are effective to remove residues from plasma process generated organic, metal-organic materials, inorganic salts, oxides, hydroxides or complexes in combination with or exclusive of organic photoresist films at low temperatures with little corrosion of copper and attack of dielectric substrates.
Claims5
A cleaning composition for post-etch ash cleaning of semiconductor devices having a film or residue of an organic, metal organic polymer, inorganic salt, oxide, hydroxide, and/or complexes or combinations thereof comprising:
- from about 4 to 14% by weight monoethanolamine;
- from about 2 to 6.0% by weight Tetralkylammonium hydroxide;
- from about 0.3 to 3.5% by weight fluoride ion resulting from ionization of a salt of a non-metallic fluoride compound in said composition;
- 0.5 to 10% by weight ascorbic acid;
- balance deionized water.
Dependencies are inferred from the claim text.