Diamond tool
AssigneesEhwa Diamond Industrial Co., Ltd., General Tool, Inc.
InventorsSoo Kwang Kim, So Young Yoon, Jong Ho Kim
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AssigneesEhwa Diamond Industrial Co., Ltd., General Tool, Inc.
InventorsSoo Kwang Kim, So Young Yoon, Jong Ho Kim
Estimating the term…
A segment type diamond tool, used for cutting or drilling brittle substances, such as stones, bricks, concrete structures, or asphalt structures, is disclosed. In the diamond tool, the segments are each set with diamonds in a single-layered structure or a multi-layered structure, and are alternately or intermittently arranged on a steel core, different from conventional diamond tools having segments randomly set with diamonds. Such a diamond arrangement of this invention allows the diamonds to more effectively perform their cutting action, and so the diamond tool has an increased cutting rate, in addition to reducing the amount of fine debris generated during a cutting or drilling process to ill-affect worker's health or cause environmental pollution. In the segments each set with diamonds in the single-layered or multi-layered structure, the diamond arrangement is designed such that the diamonds of each trailing segment form grooves on the surface of a brittle substance along the lands between grooves previously formed on the surface of the brittle substance by the diamonds of a leading segment.
A diamond tool comprising a plurality of segments including diamonds for cutting a brittle substance, sintered metal powder for attaching the diamonds to the segments, and a steel core, wherein:
A diamond tool comprising a plurality of segments including diamonds for cutting a surface of a brittle substance, sintered metal powder attaching the diamonds to the segments, and a steel core, wherein:
Dependencies are inferred from the claim text.