Method and system for wafer level testing and burning-in semiconductor components

A method for testing and burning-in semiconductor components comprising:

• providing the components on a substrate with a plurality of resilient contact structures on each component;
• testing the components on the substrate to identify functional components and a defective component;
• deforming the resilient contact structures on the defective component to provide deformed contact structures thereon;
• and
• burn-in testing the functional components on the substrate by electrically engaging the resilient contact structures but not the deformed contact structures.

A method for testing and burning-in semiconductor components comprising:

• providing the components on a substrate with a plurality of resilient contact structures on each component;
• testing the components on the substrate to identify functional components and at least one defective component;
• electrically isolating the at least one defective component by deforming the resilient contact structures thereon;
• and
• burn-in testing the functional components on the substrate by electrically engaging the resilient contact structures on the functional components.

A method for testing and burning-in a plurality of semiconductor components contained on a substrate comprising:

• providing each component with a plurality of terminal contacts;
• providing a deformation apparatus configured to deform selected terminal contacts on a selected component;
• deforming the selected terminal contacts using the deformation apparatus to provide deformed terminal contacts on the selected component;
• and
• burn-in testing the components by electrically engaging the terminal contacts on the components other than the deformed terminal contacts on the selected component.

A method for testing and burning-in semiconductor components comprising:

• providing the components on a substrate with a plurality of contact structures on each component;
• testing the components on the substrate to identify functional components and at least one defective component;
• providing a deformation apparatus configured to deform the contact structures on the at least one defective component;
• deforming the contact structures on the at least one defective component using the deformation apparatus to provide deformed contact structures thereon;
• providing a test board in electrical communication with test circuitry and configured to electrically engage the contact structures but not the deformed contact structures;
• and
• burn-in testing the functional components using the test board.