Micro-electro-discharge machining method and apparatus

A method of micro-electro-discharge machining comprising:

• (a) providing a plurality of micro-electro-discharge electrodes arranged in an array on a substrate;
• (b) positioning the electrode array adjacent to a workpiece to be machined with dielectric fluid between the electrodes and the workpiece;
• and
• (c) applying a continuous voltage between the workpiece and each electrode individually to charge a capacitor electrically connected between the workpiece and each electrode until the charge on the capacitor builds to a sufficient level to provide a discharge of current between each electrode and the workpiece to electromachine the workpiece.

Micro-electro-discharge machining apparatus comprising:

• (a) a substrate having a surface;
• (b) a plurality of electrically conductive electrodes formed on the substrate in an array and extending upwardly away from the surface of the substrate;
• (c) a plurality of electrical interconnect lines formed on the substrate, each interconnect line in electrical contact with at least one of the electrodes to allow current to be supplied thereto through the interconnect line;
• (d) an electrical power source having a positive terminal and a negative terminal;
• and
• (e) a conductor electrically connecting one of the terminals of the power source to the interconnect lines through a resistor for each interconnect line that has a selected resistance, and a capacitor connected to each interconnect line and to the other terminal of the power source.

Micro-electro-discharge machining apparatus comprising:

• (a) an electrically conductive substrate having a surface;
• (b) an insulating layer formed on the surface of the substrate;
• (c) a plurality of electrically conductive electrodes formed on the insulating layer in an array and extending upwardly away from the surface of the substrate;
• and
• (d) an electrical interconnect line formed on the insulating layer, the interconnect line in electrical contact with the electrodes to allow current to be supplied thereto in parallel through the interconnect line, the interconnect line defining a capacitor with the substrate and separated therefrom by the insulating layer, and a resistor having a selected resistance electrically connected to the interconnect line.