Optical module and method of manufacture thereof, semiconductor device, and optical transmission device
AssigneeSeiko Epson Corporation
InventorsKazunori Sakurai, Kazushige Umetsu, Akihiro Murata
Life of this patent
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Abstract
An optical module comprising: an optical fiber; an optical element having an optical section and with a fixed position relative to the optical fiber; and a semiconductor chip electrically connected to the optical element, and the optical element and semiconductor chip being packaged. A hole is formed in the semiconductor chip, and the optical element is mounted on the semiconductor chip with the optical section facing the hole, and the optical fiber is inserted in the hole and fitted to the semiconductor chip.
Claims21
An optical module, comprising:
- an optical waveguide;
- an optical element having an optical section;
- and
- a semiconductor chip, the semiconductor chip having an internal circuit for driving the optical element, the semiconductor chip electrically connected to the optical element,
- wherein the optical element and the semiconductor chip are stacked, and the optical element and the semiconductor chip are packaged,
- wherein a through hole is formed in the semiconductor chip;
- wherein the optical waveguide is inserted into the through hole;
- wherein the optical element is disposed so that the optical section and one end surface of the inserted optical waveguide are opposed;
- and
- wherein a transparent underfill material is provided between the optical element and the semiconductor chip.
A semiconductor device, comprising:
- an optical element having an optical section;
- and
- a semiconductor chip, the semiconductor chip having an internal circuit for driving the optical element, the semiconductor chip electrically connected to the optical element,
- wherein the optical element and the semiconductor chip are stacked, and the optical element and the semiconductor chip are packaged,
- wherein a through hole is formed in the semiconductor chip, and
- wherein a transparent underfill material is provided between the optical element and the semiconductor chip.
An optical transmission device, comprising:
- an optical waveguide;
- a light-emitting element having a light-emitting section facing one end surface of the optical waveguide;
- a first semiconductor chip, the first semiconductor chip having an internal circuit for driving the light-emitting element, the first semiconductor chip electrically connected to the light-emitting element, the first semiconductor chip and the light-emitting element stacked and packaged;
- a light-receiving element having a light-receiving section facing the other end surface of the optical waveguide;
- and
- a second semiconductor chip, the second semiconductor chip having an internal circuit for driving the light-receiving element, the second semiconductor chip electrically connected to the light-receiving element, the second semiconductor chip and the light-receiving element stacked and packaged,
- wherein first and second through holes are respectively formed in the first and second semiconductor chips;
- and
- wherein both ends of the optical waveguide are respectively inserted into the first and second through holes.
A method of manufacture of an optical module having at least an optical waveguide, an optical element having an optical section, and a semiconductor chip having an internal circuit for driving the optical element, the method comprising the steps of:
- stacking the optical element and the semiconductor chip;
- electrically connecting the optical element and the semiconductor chip;
- relatively positioning the optical waveguide and the optical element;
- providing a transparent underfill material between the optical element and the semiconductor chip;
- and
- packaging the optical element and the semiconductor chip,
- wherein a through hole is formed in the semiconductor chip;
- and
- wherein the step of relatively positioning the optical waveguide and the optical element includes a step of inserting the optical waveguide into the through hole.
A method of manufacture of an optical module having at least an optical waveguide, an optical element having an optical section, and a semiconductor chip having an internal circuit for driving the optical element, the method comprising the steps of:
- stacking the optical element and the semiconductor chip;
- electrically connecting the optical element and the semiconductor chip;
- relatively positioning the optical waveguide and the optical element;
- and
- packaging the optical element and the semiconductor chip,
- wherein a through hole is formed in the semiconductor chip;
- and
- wherein the step of relatively positioning the optical waveguide and the optical element includes a step of inserting the optical waveguide into the through hole, the method further comprising,
- forming a depression in a region in which the through hole is to be formed in the semiconductor chip by anisotropic etching, and then penetrating the depression by a laser, to form the hole in the semiconductor chip.
An optical transmission device, comprising:
- an optical waveguide;
- a light-emitting element having a light-emitting section;
- a first semiconductor chip, the first semiconductor chip having an internal circuit for driving the light-emitting element, the first semiconductor chip electrically connected to the light-emitting element, the first semiconductor chip and the light-emitting element being packaged;
- a first substrate on which the light-emitting element and the semiconductor chip are disposed, the first substrate having a first through hole formed therein, a first end portion of the optical waveguide inserted in the first through hole, the light-emitting section facing the first through hole,
- a light-receiving element having a light-receiving section;
- a second semiconductor chip, the second semiconductor chip having an internal circuit for driving the light-receiving element, the second semiconductor chip electrically connected to the light-receiving element, the second semiconductor chip and the light-receiving element being packaged;
- a second substrate on which the light-emitting element and the semiconductor chip are disposed, the second substrate having a second through hole formed therein, a second end portion of the optical waveguide inserted in the second through hole, the light-emitting section facing the second through hole.
Dependencies are inferred from the claim text.