Devices incorporating electrochromic elements and optical sensors

A device comprising:

• an electrochromic element having a transmittance that varies in response to an electrical signal;
• a base substrate disposed in spaced relation to said electrochromic element;
• a seal disposed between said base substrate and said electrochromic element, said seal, base substrate, and said electrochromic element forming a sealed cavity therebetween;
• and
• an optical sensor disposed on said base substrate within the sealed cavity.

An image sensor package comprising:

• a base substrate having a plurality of conductive strips disposed thereon;
• an electrochromic element having a transmittance that varies in response to an electrical signal;
• and
• an image sensor array disposed on said-base substrate between said base substrate and said electrochromic element, said image sensor array is electrically coupled to said conductive strips,
• wherein said electrochromic element is carried on one of said base substrate and said image sensor array.

A package for encapsulating an integrated circuit optical sensor, the package mountable on a support substrate, the sensor having a bottom surface and a top surface, the top surface comprising imaging electronics connected to a plurality of sensor bonding pads, the sensor bonding pads operable to provide bonding points for connections off the sensor, the package comprising:

• a glass base substrate with a top surface and a bottom surface, the base substrate top surface having the optical sensor bottom surface bonded thereon;
• a plurality of conductive strips upon the base substrate top surface, each conductive strip extending from a region near the optical sensor to an edge of the base substrate top surface;
• a plurality of wires, each wire bonded on one end to a sensor bonding pad for which connection is desired and bonded on the other end to a corresponding conductive strip;
• means for connecting each conductive strip to a corresponding trace on the support substrate;
• and
• a glass window bonded to the base substrate top surface in a spaced-apart relationship by a seal material, the seal material extending around the sensor enclosing each wire bond but not enclosing any of the means for connecting each conductive strip to a corresponding trace, the window admitting light to the optical sensor.

A package for encapsulating an integrated circuit optical sensor, the package mountable on a support substrate, the sensor comprising a top surface having imaging electronics connected to a plurality of sensor bonding pads, the sensor bonding pads operable to provide flip chip bonding points for connections off the sensor, the package comprising:

• a base substrate with a top surface and a bottom surface, the base substrate constructed of an insulating material;
• a plurality of conductive strips upon the base substrate bottom surface, the optical sensor top surface flip chip bonded on the base substrate bottom surface such that each sensor bonding pad is bonded to a corresponding conductive strip, each conductive strip extending to the edge of the base substrate;
• and
• means for connecting each conductive strip to a corresponding trace on the support substrate.