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US 6,621,172 B2Granted
Semiconductor device and method of fabricating the same, circuit board, and electronic equipment
AssigneeSeiko Epson Corporation
InventorsHirohisa Nakayama, Jun Taniguchi, Takashi Abe, Toshinori Nakayama
Life of this patent
Estimating the term…
Abstract
A first semiconductor chip is mounted on a substrate on which an interconnect pattern is formed, and a surface of the first semiconductor chip having electrodes faces the substrate. A second semiconductor chip is mounted on the first semiconductor chip. Electrodes of the second semiconductor chip are electrically connected to the interconnect pattern by wires. A first resin is provided between the first semiconductor chip and the substrate, and a second resin which differs from the first resin seals the first and second semiconductor chips.
Claims24
A semiconductor device comprising:
- a first semiconductor chip which has a surface having a plurality of electrodes and is mounted on a substrate having an interconnect pattern, wherein the surface having the electrodes faces the substrate and the electrodes are electrically connected to the interconnect pattern;
- a second semiconductor chip which has a surface having a plurality of electrodes and is mounted on the first semiconductor chip, wherein the surface of the second semiconductor chip having the electrodes opposes the first semiconductor chip and the electrodes of the second semiconductor chip are electrically connected to the interconnect pattern through wires;
- a first resin provided between the substrate and the first semiconductor chip;
- and
- a second resin which differs from the first resin and seals the first and second semiconductor chips to the substrate,
- wherein the first resin is provided so as to extend to the sides of both the first semiconductor chip and the second semiconductor chip.
3 more elements
A semiconductor device comprising:
- a first semiconductor chip which has a surface having a plurality of electrodes and is mounted on a substrate having an interconnect pattern, wherein the surface having the electrodes faces the substrate and the electrodes are electrically connected to the interconnect pattern;
- a second semiconductor chip which has a surface having a plurality of electrodes and is mounted on the first semiconductor chip, wherein the surface of the second semiconductor chip having the electrodes opposes the first semiconductor chip and the electrodes of the second semiconductor chip are electrically connected to the interconnect pattern through wires;
- a first resin provided between the substrate and the first semiconductor chip;
- and
- a second resin which differs from the first resin and seals the first and second semiconductor chips to the substrate,
- wherein the first semiconductor chip is larger than the second semiconductor chip such that the first semiconductor chip has a protruding upper surface that protrudes beyond the second semiconductor chip, and the protruding upper surface is entirely covered with the second resin.
3 more elements
A semiconductor device comprising:
- a first semiconductor chip which has a surface having a plurality of electrodes and is mounted on a substrate having an interconnect pattern, wherein the surface having the electrodes faces the substrate and the electrodes are electrically connected to the interconnect pattern;
- a second semiconductor chip which has a surface having a plurality of electrodes and is mounted on the first semiconductor chip, wherein the surface of the second semiconductor chip having the electrodes opposes the first semiconductor chip and the electrodes of the second semiconductor chip are electrically connected to the interconnect pattern through wires;
- a first resin provided between the substrate and the first semiconductor chip;
- and
- a second resin which differs from the first resin and seals the first and second semiconductor chips to the substrate,
- wherein the first semiconductor chip is smaller than the second semiconductor chip such that the second semiconductor chip has a protruding bottom surface that protrudes beyond the first semiconductor chip and an opposing bottom surface that opposes the first semiconductor chip, and the first resin is provided so as to touch the protruding bottom surface and avoid the opposing bottom surface.
3 more elements
A method of fabricating a semiconductor device comprising the steps of:
- face-down bonding a first semiconductor chip to a substrate on which an interconnect pattern is formed;
- mounting a second semiconductor chip on the first semiconductor chip;
- electrically connecting the second semiconductor chip to the interconnect pattern through wires;
- providing a first resin between the first semiconductor chip and the substrate;
- and
- sealing the first and second semiconductor chips with a second resin which differs from the first resin;
- wherein the first resin is provided so as to extend to the sides of both the first semiconductor chip and the second semiconductor chip.
4 more elements
Dependencies are inferred from the claim text.