Process conditions and precursors for atomic layer deposition (ALD) of AL2O3
AssigneeApplied Materials, Inc.
InventorsKevin Song, Jallepally Ravi, Shih-Hung Li, Liang-Yuh Chen
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AssigneeApplied Materials, Inc.
InventorsKevin Song, Jallepally Ravi, Shih-Hung Li, Liang-Yuh Chen
Estimating the term…
A semiconductor processing chamber has been utilized to perform sequential deposition of high-K Al2O3 thin films on a substrate disposed in the chamber employing low viscosity precursors. The method commences with introduction of an aluminum precursor into the processing chamber. In this manner, a monolayer of aluminum precursor is chemisorbed onto the substrate surface. Thereafter, non-chemisorbed aluminum precursor is purged from the processing chamber, followed by introduction of an oxygen precursor. The oxygen precursor reacts with the chemisorbed layer, resulting in a monolayer of Al2O3. Finally, excess oxygen precursor and by-products of the reaction are purged completing the sequential deposition cycle. The sequential deposition cycle can be repeated to grow the Al2O3 film to a desired thickness.
A method for depositing an aluminum-containing layer on a substrate disposed in a processing chamber, said method comprising:
A method for depositing an aluminum-containing layer onto a substrate disposed in a processing chamber, said method comprising:
A processing system for forming an aluminum-containing layer on a substrate, said system comprising:
Dependencies are inferred from the claim text.