US 6,618,269 B2 · Discrete circuit component and process of fabrication

Abstract

A discrete circuit component comprises a circuit component die having a first electrode and a second electrode. A surface of a first substrate has an electrically-conductive trace electrically connected to the first electrode of the circuit component die, and a surface of a second substrate also has an electrically-conductive trace electrically connected to the second electrode of the circuit component die. A first terminal electrode is electrically connected to the conductive trace of the first substrate, surface of the first terminal electrode is orthogonal to the longitudinal axis of the conductive trace of the first substrate. A second terminal electrode is electrically connected to the conductive trace of the second substrate, and surface of the second terminal electrode is orthogonal to the longitudinal axis of the conductive trace of the second substrate. The first and second substrates are parallel to each other and encloses the circuit component die. The conductive trace of the first substrate leads away from the circuit component die in the direction opposite to the direction in which the conductive trace of the second substrate leads away from the circuit component die. The space between the first and second substrates not being occupied by the circuit component die is filled with a material the same as the material for the first and second substrates. The filled material encloses the circuit component die completely.

Claims30

Dependent claims

A discrete circuit component, comprising:

a circuit component die having a first electrode and a second electrode;
a first substrate, a surface of said first substrate having an electrically-conductive trace electrically connected to said first electrode of said circuit component die;
a second substrate, a surface of said second substrate having an electrically-conductive trace electrically connected to said second electrode of said circuit component die;
a first terminal electrode electrically connected to said conductive trace of said first substrate, surface of said first terminal electrode being orthogonal to the longitudinal axis of said conductive trace of said first substrate;
a second terminal electrode electrically connected to said conductive trace of said second substrate, surface of said second terminal electrode being orthogonal to the longitudinal axis of said conductive trace of said second substrate;
wherein
said first substrate and said second substrate being parallel to each other and enclosing said circuit component die, said conductive trace of said first substrate leading away from said circuit component die in the direction opposite to the direction in which said conductive trace of said second substrate leading away from said circuit component die, and the space between said first and said second substrate not being occupied by said circuit component die being filled with a material the same as the material for said first substrate and said second substrate, and said filled material enclosing said circuit component die completely.

4 more elements

A process for fabricating discrete circuit components comprising the steps of:

(a) forming a matrix of a plurality of first electrically conductive traces on a first substrate;
(b) placing a circuit component die on each of said first conductive traces, with a first electrode of said circuit component die electrically connected to the corresponding first conductive trace;
(c) covering each of said circuit component dies with a second substrate, a surface of said second substrate having a matrix of a plurality of second electrically conductive traces each electrically connected to the second electrode of the corresponding one of said circuit component dies;
(d) filling the spaces between said first substrate and said second substrate un-occupied by said circuit component dies with the same material as that for said first and second substrates, said filled material completely surrounding said dies and forming an enclosed matrix of circuit component dies;
(e) separating said enclosed matrix of circuit component dies into one-dimensional component arrays of a plurality of discrete circuit components;
(f) covering each of the edges of said separated component arrays revealed after said separation with a layer of terminal electrode, one of two terminal electrodes for each of said component arrays being electrically connected to said first conductive traces and the other of said two terminal electrodes being electrically connected to said second conductive traces;
and
(g) cutting each of said component arrays into a plurality of individual discrete circuit components.

5 more elements

Dependencies are inferred from the claim text.

Discrete circuit component and process of fabrication

Life of this patent

Discrete circuit component and process of fabrication

Life of this patent

Abstract

Claims30