Data storage housing

An enclosure for an electronic unit, the electronic unit having at least one first connector on an end thereof, the enclosure comprising:

• a top cover;
• a bottom cover arranged to mate with said top cover to form a hermetically sealed enclosure;
• at least one second connector on one of said top and bottom covers arranged to mate with said first connector;
• at least two side rails rigidly fastened to the electronic unit;
• a resilient support connected to said at least two side rails and to at least one of said top and bottom covers for resiliently supporting the electronic unit in said enclosure, said resilient support being formed of a material having a high resistance to thermal conduction;
• at least two thermal rails;
• at least one resilient thermal conductor having a first end permanently mounted to a respective one of said at least two thermal rails and a second end permanently mounted to one of the group consisting of said side rails, said top cover and said bottom cover;
• a fastener removably mounting said thermal rails to another of the group consisting of said side rails, said top cover and said bottom cover so that said thermal rails and resilient thermal conductors provide conduction of thermal energy between said side rails and one of said covers.

An apparatus, comprising:

• an array module having:
• a housing having a rear plate and opposing side walls defining a module chamber,
• a plurality of mounting locations on said side walls of said housing and in said module chamber,
• a plurality of electronic units having at least one mounting feature fixed thereto, said at least one mounting feature being assembled to at least one respective ones of said mounting locations so that said housing supports said electronic units in said module chamber, each of said electronic units having at least one first connector,
• a plurality of second connectors in said module chamber, each said first connector on said electronic units mating with a respective second connector, and
• at least one third connector on said housing connected to said plurality of second connectors to provide electrical connection to each of said plurality of electronic units;
• an installation frame having:
• a rear wall and opposing side walls defining an installation chamber,
• a plurality of resilient mounts fastened to external surfaces of said installation frame, each said mount being arranged to be fastened to a support platform to isolate said installation frame from mechanical shock or vibration in said support platform,
• at least one fourth connector on said installation frame, said at least one fourth connector mating with said at least one third connector, and
• at least one external connector connected to said at least one fourth connector for providing electrical connection to said at least one fourth connector.

An apparatus, comprising:

• an array module having:
• a housing having a rear plate and opposing side walls defining a hermetically sealed module chamber,
• a plurality of mounting locations on said side walls of said housing and in said module chamber,
• a plurality of electronic units having at least one mounting feature fixed thereto, said at least one mounting feature being assembled to at least one of respective ones of said mounting locations so that said housing supports said electronic units in said module chamber, each of said electronic units having at least one first connector,
• a plurality of second connectors in said module chamber, each said first connector on said electronic units mating with a respective second connector, and
• at least one third connector on said housing connected to said plurality of second connectors to provide electrical connection to each of said, plurality of electronic units;
• an installation frame having:
• a rear wall and opposing side walls defining an installation chamber,
• a plurality of resilient mounts fastened to external surfaces of said installation frame, each said mount being arranged to be fastened to a support platform to isolate said installation frame from mechanical shock or vibration in said support platform,
• at least one fourth connector on said installation frame, said at least one fourth connector mating with said at least one third connector, and
• at least one external connector connected to said at least one fourth connector for providing electrical connection to said at least one fourth connector;
• and
• heat transfer means for transferring thermal energy between said electronic units and a region exterior to said installation frame.

An enclosure for an electronic unit, the electronic unit having at least one first connector on an end thereof, the enclosure comprising:

• a top cover;
• a bottom cover arranged to mate with said top cover to form a hermetically sealed enclosure;
• at least one second connector on one of said top and bottom covers arranged to mate with said first connector;
• at least two side rails rigidly fastened to the electronic unit;
• a thermally conductive resilient support connected to said at least two side rails and to at least one of said top and bottom covers for resiliently supporting said electronic unit in said enclosure chamber and for conducting thermal energy between said two side rails and one of said top and bottom covers.

An apparatus, comprising:

• a stack of at least two enclosures for electronic units, the electronic units having a first connector on an end thereof and, each said enclosure comprising:
• a top cover;
• a bottom cover arranged to mate with said top cover to form a hermetically sealed enclosure;
• at least one second connector on one of said top and bottom covers arranged to mate with said first connector;
• at least two side rails rigidly fastened to the electronic unit;
• a resilient support connected to said at least two side rails and to at least one of said top and bottom covers for resiliently supporting the electronic unit in said enclosure, said resilient support being formed of a material having a high resistance to thermal conduction;
• at least two thermal rails;
• at least one resilient thermal conductor having a first end permanently mounted to a respective one of said at least two thermal rails and a second end permanently mounted to one of the group consisting of said side rails, said top cover and said bottom cover;
• a fastener removably mounting said thermal rails to another of the group consisting of said side rails, said top cover and said bottom cover so that said thermal rails and resilient thermal conductors provide conduction of thermal energy between said side rails and one of said covers.

An apparatus, comprising:

• a stack of at least two enclosures for electronic units, said electronic units having a first connector on an end thereof, each said enclosure comprising:
• a top cover,
• a bottom cover arranged to mate with said top cover to form a hermetically sealed enclosure chamber;
• a sixth connector on one of said top and bottom covers arranged to mate with said fifth connector;
• at least two side rails for rigidly fastening to said electronic unit;
• a thermally conductive resilient support connected to said at least two side rails and to at least one of said top and bottom covers for resiliently supporting said electronic unit in said enclosure chamber and for conducting thermal energy between said two side rails and one of said top and bottom covers.