Microwave package

A surface mount package for a microwave integrated circuit, the package comprising:

• a base having a first side and a second side, the first side receiving the microwave integrated circuit, the second side being surface mountable to a circuit board;
• a wave guide for carrying a signal on the base, the wave guide electrically coupling an output of the microwave integrated circuit to a signal path on the circuit board;
• and
• a set of vias residing within the base wherein the vias include a conductive material that provides a ground to prevent feedback of the signal through the base to an input of the microwave integrated circuit.

A surface mount package for a microwave integrated circuit, the microwave circuit having an input and an output for carrying a signal, the package comprising:

• a base having a first side for receiving the microwave integrated circuit and a second side opposed to the first side, the base further having a third side connecting the first and second sides, the first side defined by an input edge and an output edge, a portion of the third side forming an input edge castellation, the second side being adapted for mounting to a circuit board wherein the signal is received at the input edge castellation;
• a conductive material residing partially on the first side forming a wave guide from the input edge castellation to a point on the first side where the input of the microwave integrated circuit is received;
• and
• a plurality of vias extending through the base positioned to block propagation of the signal through the base to the output of the microwave integrated circuit.

A surface mount package for a microwave integrated circuit, the microwave circuit having input and an output for carrying a signal, the package comprising:

• a base having a first side for receiving the microwave integrated circuit and a second side opposed to the first side, the base further having a third side connecting the first and second sides, the first side having an input edge and an output edge, the second side being adapted for mounting to a circuit board;
• a conductive material residing on the first side forming an electromagnetic wave guiding structure from the input edge to a point on the first side where the input of the microwave integrated circuit is received, the conductive material also positioned on the base so as to electrically couple the first side and the second side so that the signal may be transmitted from the circuit board to the input of the microwave integrated circuit;
• and
• a plurality of vias extending through the base positioned to block propagation of the signal to an output of the microwave integrated circuit.

A surface mount package for a microwave integrated circuit operating on a signal, the integrated circuit having at least one input and at least one output, the package comprising:

• a base having a top and a bottom and at least one side wherein the top is adapted to receive an integrated circuit;
• the top having a metalized waveguide for coupling the input of the integrated circuit to the side of the base;
• the top having a metalized waveguide for coupling the output of the integrated circuit to the side of the base;
• the side of the base being partially metalized for transitioning the signal from the bottom of the base to the metalized waveguide coupled to the input of the integrated circuit;
• the side of the base being partially metalized for transitioning the signal from the bottom of the base to the metalized waveguide coupled to the output of the integrated circuit;
• a cover connected to the base enclosing the integrated circuit;
• vias in the base spaced to prevent substantially all of the signal from feeding back into the integrated circuit;
• and
• connection receiving means for connecting the surface mount package to a circuit board.

A surface mount package for a microwave circuit, the surface mount package permitting communication of a signal between a printed circuit board and the microwave circuit defining a signal path, the package comprising:

• a base having a first side and a second side, the second side for surface mounting to the printed circuit board;
• a port on the base accessible from the second side for permitting communication of the signal between the transmission line and the printed circuit board;
• a transmission line located on the first side for carrying the signal in a transmission line mode, the transmission line providing electrical coupling with a terminal of the microwave circuit and the port;
• and
• a set of vias in the base, wherein each via includes a conductive material wherein the set of vias are arranged to prevent propagation of a radiated portion of the signal in the base back into the signal path.

A surface mount package for a microwave integrated circuit, the package comprising:

• a base having a first side and a second side, the first side receiving the microwave integrated circuit, the second side being surface mountable to a circuit board;
• a wave guide on the first side of the base for carrying a signal from an output of the microwave integrated circuit to a port;
• wherein the port provides electrical communication between the wave guide on the first side to the second side of the base and to the circuit board;
• and
• a set of vias residing within the base wherein the vias include a conductive material that provides a ground to prevent feedback of the signal through the base to an input of the microwave integrated circuit.

A surface mount package for a microwave circuit, the surface mount package permitting communication of a signal between a printed circuit board and the microwave circuit defining a signal path, the package comprising:

• a base having a first side and a second side, the second side for surface mounting to the printed circuit board;
• a port on the base accessible from the second side for permitting communication of the signal between the transmission line and the printed circuit board;
• a transmission line located on the first side for carrying the signal in a transmission line mode, the transmission line providing electrical coupling with a terminal of the microwave circuit and the port;
• and
• a set of grounding vias in the base, wherein each via includes a conductive material wherein the set of vias at least reside underneath a position on the base where the microwave circuit is to be mounted.