Package substrate interconnect layout for providing bandpass/lowpass filtering
AssigneeApplied Micro Circuits Corporation
InventorSiamak Fazelpour
Life of this patent
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Abstract
An electronic device package includes a multilayer substrate having an interconnect structure configured to propagate a high frequency signal from one metal layer to another metal layer. The configuration and layout of the interconnect structure, particularly the arrangement of the reference vias associated with the signal via, is selected such that a desired filter response is achieved. The filter response is realized without any additional capacitor or inductor components. Thus, the natural discontinuity created by the vias and the inherent parasitic capacitance and inductance associated with the vias can be utilized to create a desired lowpass or bandpass filter response.
Claims28
An electronic interconnect structure comprising:
- signal via formed within a multilayer substrate having a first metal layer and a second metal layer;
- at least one reference via formed within said multilayer substrate, said at least one reference via and said signal via being configured to propagate a signal from said first metal layer to said second metal layer, said at least one reference via and said signal via being further configured to provide a bandpass filter response for said signal.
A method for fabricating an electronic interconnect structure comprising:
- obtaining a bandpass filter characteristic for a signal propagating through a multilayer substrate having a first metal layer and a second metal layer,
- designating a position within said multilayer substrate for a signal via;
- and
- determining a geometric configuration for said signal via and for at least one reference via to provide said bandpass filter characteristic for said signal.
An electronic package comprising:
- a multilayer substrate having a plurality of metal layers;
- a conductive signal element formed on one of said plurality of metal layers;
- a conductive reference element formed on one of said plurality of metal layers;
- a signal via formed within said multilayer substrate and connected to said conductive signal element;
- and
- a reference via formed within said multilayer substrate and connected to said conductive reference element, said reference via and said signal via being configured to provide a bandpass filter characteristic for a signal propagating through said multilayer substrate.
Dependencies are inferred from the claim text.