RF amplifier
AssigneeKabushiki Kaisha Toshiba
InventorToshiki Seshita
Life of this patent
Estimating the term…
Abstract
A node for commonly supplying a ground potential in an amplification circuit (MMIC11) is formed. The input and output system ground surfaces of a printed wiring board (PWB) on which the amplification circuit (MMIC11) is to be mounted are electrically separated from each other on the printed wiring board (PWB). Since no ground pattern is present on the amplification circuit (MMIC11), the ground node of the amplification circuit (MMIC11) serves as a means for supplying a true ground potential. While a compact package is realized by preventing an increase in number of leads, oscillation is prevented, so a high gain can be realized.
Claims5
An RF amplifier in which an amplification circuit with at least two amplification stages is mounted on a printed wiring board, comprising:
- a ground node formed in the amplification circuit to commonly supply a ground potential to all the amplification stages;
- a first ground surface formed on the printed wiring board to supply a ground potential on an input system transmission line that transmits an input signal to be supplied to the amplification circuit;
- a second ground surface, which is formed on the printed wiring board to supply a ground potential on an output system transmission line that transmits an output signal output from the amplification circuit, is electrically separated from said first ground surface on the printed wiring board, and is connected to said first ground surface through said ground node in the amplification circuit;
- and
- a capacitor element electrically connected between those ones of power supply terminals of the amplification stages, excluding one on a final stage, included in the amplification circuit, and a third ground terminal electrically connected to said ground node, and mounted on the printed wiring board,
- wherein
- the amplification circuit comprises,
- an input terminal for receiving the input signal,
- an output terminal for outputting the output signal,
- a first ground terminal electrically connected to said first ground surface, and
- a second ground terminal electrically connected to said second ground surface, wherein
- said first ground terminal is adjacent to said input terminal, and/or said second ground terminal is adjacent to said output terminal.
An RF amplifier in which an amplification circuit with at least two amplification stages is mounted on a printed wiring board, comprising:
- a ground node formed in the amplification circuit to commonly supply a ground potential to all the amplification stages;
- a first ground surface formed on the printed wiring board to supply a ground potential on an input system transmission line that transmits an input signal to be supplied to the amplification circuit;
- a second ground surface, which is formed on the printed wiring board to supply a ground potential on an output system transmission line that transmits an output signal output from the amplification circuit, is electrically separated from said first ground surface on the printed wiring board, and is connected to said first ground surface through said ground node in the amplification circuit;
- and
- a capacitor element electrically connected between those ones of power supply terminals of the amplification stages, excluding one on a final stage, included in the amplification circuit, and a third ground terminal electrically connected to said ground node, and mounted on the printed wiring board.
Dependencies are inferred from the claim text.