Light-emitting system with alicyclic epoxy sealing member
AssigneeToyoda Gosei Co., Ltd.
InventorsHisaki Kato, Kanae Matsumura, Akira Mabuchi, Naoki Yoshimura, Kazuhiro Sakai
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Abstract
An alicyclic epoxy resin is used as a material for forming a member for sealing a Group III nitride compound semiconductor light-emitting device.
Claims18
A light-emitting system, comprising:
- a Group III nitride compound semiconductor light-emitting device;
- and
- a light-transmissible layer surrounding said light-emitting device;
- wherein said light-transmissible layer comprises a substantially alicyclic epoxy resin having an aromatic ring hydrogenation ratio of not lower than 85%;
- and
- wherein said light-transmissible layer is cationically-polymerized.
A sealing member for surrounding a Group III nitride compound semiconductor light-emitting device, comprising a substantially alicyclic epoxy resin having an aromatic ring hydrogenation ratio of not less than 85%;
- wherein said substantially alicyclic epoxy resin is cationically-polymerized;
- and
- wherein said sealing member is shaped to surround at least a portion of the Group III nitride semiconductor light-emitting device.
A sealing member comprising a hydrogenated aromatic epoxy resin having an aromatic ring hydrogenation ratio of not less than 85%, the hydrogenated aromatic epoxy resin comprising one or more members selected from the group consisting of a bisphenol epoxy resin, a novolac epoxy resin and a multifunctional epoxy resin;
- wherein said aromatic epoxy resin is cationically-polymerized;
- and
- wherein said sealing member is shaped to surround at least a portion of a Group III nitride compound semiconductor light-emitting device.
Dependencies are inferred from the claim text.