US 6,617,702 B2 · Semiconductor device utilizing alignment marks for globally aligning the front and back sides of a semiconductor substrate

Abstract

The present invention provides for globally aligning microelectronic circuit systems, such as communication devices and chips, fabricated on or bonded to the front and back sides of one or more substrates to provide for wireless communications between the circuit systems through the one or more substrates. In one embodiment, two circuit systems situated on opposite sides of a substrate are aligned to provide for wireless communications between the two circuit systems through the substrate. In another embodiment, communication devices situated on one or more substrates are aligned to provide for wireless communications between the communication devices through the one or more substrates. In another embodiment, two chips situated on opposite sides of a transparent substrate are aligned to provide for wireless communications between the two chips through the transparent substrate.

Claims34

Dependent claims

A microelectronic system comprising at least one package having:

at least one substrate having aligned global alignment marks formed in said at least one substrate by a photoresist having an alignment pattern irradiated on opposing surfaces of the at least one substrate;
and
first and second circuit system opposing surfaces of the at least one substrate, each of said first and second circuit systems having means for wirelessly communicating with each other through said at least one substrate, wherein said first and second systems are aligned via said global alignment marks.

Dependencies are inferred from the claim text.

Semiconductor device utilizing alignment marks for globally aligning the front and back sides of a semiconductor substrate

Life of this patent

Semiconductor device utilizing alignment marks for globally aligning the front and back sides of a semiconductor substrate

Life of this patent

Abstract

Claims34