Epoxy resin composition to seal semiconductors and resin-sealed semiconductor device
AssigneeToray Industries, Inc.
InventorsMasayuki Tanaka, Yumiko Tsurumi
Life of this patent
Estimating the term…
Abstract
An epoxy resin composition to seal semiconductors constructed of a semiconductor element, a base to support said semiconductor element, and an epoxy resin composition covering only one side opposite to the base, said epoxy resin composition comprising (A) epoxy resin, (B) hardener, and (C) inorganic filler, and giving a cured product which has (a) a flexural modulus of elasticity of 10 to 30 GPa at 23° C. and (b) a coefficient of linear expansion of 4×10−6/K to 10×10−6/K in the temperature range from 23° C. to the glass transition point, with the product of (a) and (b) being smaller than 2×10−4 GPa/K.
Claims11
A semiconductor device comprising a semiconductor element, a base to support said semiconductor element, and an epoxy resin composition covering only one side opposite the base, wherein said epoxy resin composition comprises:
- (A) epoxy resin, (B) hardener, and (C) inorganic filler, and giving a cured product which has (a) a flexural modulus of elasticity of 10 to 30 Gpa at 23° C. and (b) a coefficient of linear expansion of 4×10−6/K to 10×10−6/K in the temperature range from 23° to the glass transition point, with the product of (a) and (b) being smaller than 2×10−4 Gpa/K.
Dependencies are inferred from the claim text.