Method of forming a test insert for interfacing a device containing contact bumps with a test substrate

A method for making an insert for electrically interfacing an electronic device to a support substrate, the electronic device containing a plurality of contact bumps and a protrusion, the support substrate containing a plurality of conductive members, the insert having first and second sides, the method comprising:

• (a) providing an insert substrate;
• (b) forming in the first side of the insert substrate a plurality of pockets configured to receive and contact the contact bumps;
• (c) forming a plurality of vias through the insert substrate to the second side which are in electrical communication with at least some of the plurality of pockets;
• (d) forming a stencil on the second side of the insert substrate, the stencil containing holes at the vicinity of the vias;
• (e) filing the holes with a conductive substance;
• and
• (f) removing the stencil to form conductive projections in electrical communication with the vias and receivable by the conductive members.