Structure for reducing die corner and edge stresses in microelectronic packages
AssigneeIntel Corporation
InventorsQing Ma, Jim Maveety, Quan Tran
Life of this patent
Estimating the term…
Abstract
A microelectronic die is aligned with a package substrate and attached to it using solder balls. A specially shaped heat spreader, preferably with a coefficient of thermal expansion (CTE) similar to that of silicon, is attached to the back side of the die using a heat-conducting adhesive. An epoxy-based material is flowed into the gap between the die, the substrate, and the heat spreader via a through-hole in either the substrate or the heat spreader using a dispense process or a transfer molding process. By positioning the heat spreader to abut the die corners and/or edges, the stresses on the die are substantially reduced or eliminated.
Claims16
A microelectronic package, comprising:
- a die;
- a substrate;
- and
- a heat spreader coupled to the backside of the die, the heat spreader including a plurality of pillars coupled to the substrate, such that thermally induced stress is shifted away from the corners and edges of the die and wherein a through-hole extends from a first exterior surface to a second exterior surface of the substrate, the through-hole configured to allow the flow of an underfill encapsulation material into a gap between the die, the substrate and the heat spreader.
A microelectronic package, comprising:
- a die;
- a substrate;
- and
- a heat spreader coupled to the backside of the die, the heat spreader including a plurality of pillars coupled to the substrate, such that thermally induced stress is shifted away from the corners and edges of the die and wherein a through-hole extends from a first exterior surface to a second exterior surface of the heat spreader, the through-hole configured to allow the flow of an underfill encapsulation material into a gap between the die, the substrate and the heat spreader.
Dependencies are inferred from the claim text.