Semiconductor device

A laminated-chip semiconductor device comprising:

• a plurality of semiconductor chips having a plurality of terminals;
• and
• a plurality of chip-mounting substrates on each of which at least one of said semiconductor chips is mounted, a plurality of relay terminals electrically connected to said respective terminals of said semiconductor chip are disposed to surround a portion with said semiconductor chip mounted thereon from the outside in the vicinity of said portion, and at least one of said semiconductor chips has a center offset from a center of a whole arrangement of said relay terminals in at least one of two or more laminated layers.

A laminated-chip semiconductor device comprising:

• a plurality of semiconductor chips having a plurality of terminals;
• and
• a plurality of chip-mounting substrates on each of which at least one of said semiconductor chips is mounted, a plurality of relay terminals electrically connected to said respective terminals of said semiconductor chip are disposed to surround a portion with said semiconductor chip mounted thereon from the outside in the vicinity of said portion, and at least one of said semiconductor chips has a center offset from a center of another semiconductor chip in at least two predetermined layers among two or more laminated layers.

A laminated-chip semiconductor device comprising:

• a first chip-mounting substrate on which at least one semiconductor chip having a plurality of terminals is mounted, and a plurality of relay terminals electrically connected to said respective terminals of said semiconductor chip are disposed to surround a portion with said semiconductor chip mounted thereon from the outside in the vicinity of said portion;
• and
• a second chip-mounting substrate which is laminated on said first chip-mounting substrate and on which at least one said semiconductor chip is mounted, a plurality of relay terminals electrically connected to said respective terminals of said semiconductor chip are disposed to surround a portion with said semiconductor chip mounted thereon from the outside in the vicinity of said portion, and at least one of said semiconductor chips has a side edge rotated by a predetermined angle from a mutual parallel state with respect to an arrangement opposite to the side edge of said semiconductor chip in a whole arrangement of said relay terminals.

A laminated-chip semiconductor device comprising:

• a plurality of semiconductor chips having a plurality of terminals;
• and
• a plurality of chip-mounting substrates on each of which at least one of said semiconductor chips is mounted, a plurality of relay terminals electrically connected to said respective terminals of said semiconductor chip are disposed to surround a portion with said semiconductor chip mounted thereon from the outside in the vicinity of said portion, and at least one of said semiconductor chips has a side edge rotated by a predetermined angle from a mutual parallel state with respect to an arrangement opposite the side edge of said semiconductor chip in a whole arrangement of said relay terminals in at least one of two or more laminated layers.

A laminated-chip semiconductor device comprising:

• a plurality of semiconductor chips having a plurality of terminals;
• and
• a plurality of chip-mounting substrates on each of which at least one of said semiconductor chips is mounted, a plurality of relay terminals electrically connected to said respective terminals of said semiconductor chip are disposed to surround a portion with said semiconductor chip mounted thereon from the outside in the vicinity of said portion, and at least one of said semiconductor chips has a side edge rotated by a predetermined angle from a mutual parallel state with respect to at least two predetermined layers among two or more laminated layers.